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INTEGRATED CIRCUITS
DATA SHEET
TDA8001 Smart card interface
Product specification Supersedes data of 1995 Feb 01 File under Integrated Circuits, IC02 1996 Dec 12
Philips Semiconductors
Product specification
Smart card interface
FEATURES * Protected I/O line * VCC regulation (5 V 5%, 100 mA max. with controlled rise and fall times) * VPP generation (12.5, 15 or 21 V 2.5%, 50 mA max., with controlled rise and fall times) (only at TDA8001 and TDA8001T) * Clock generation (up to 10 MHz), with synchronous frequency doubling * Overload, thermal and card extraction protections * Current limitation in case of short-circuit * Idle mode and special circuitry for spikes killing during powering on and off * Two voltage supervisors (digital and analog supplies) * Automatic activation and deactivation sequences through an independent internal clock * Enhanced ESD protections on card side (4 kV min.) * Easy chaining for multiple card readers * ISO 7816 compatibility. ORDERING INFORMATION TYPE NUMBER TDA8001; TDA8001A TDA8001T; TDA8001AT PACKAGE NAME DIP28 SO28 DESCRIPTION plastic dual in-line package; 28 leads (600 mil) plastic small outline package; 28 leads; body width 7.5 mm APPLICATIONS
TDA8001
* Pay TV (multistandards conditional access system, videoguard, newscript) * Multi-application smart card readers (banking, vending machine, electronic payment identification). GENERAL DESCRIPTION The TDA8001 is a complete, low-cost analog interface which can be positioned between an asynchronous smart card (ISO 7816) and a microcontroller. It is directly compatible with the new Datacom chip verifier. The complete supply, protection and control functions are realized with only a few external components, making this product very attractive for consumer applications (see Chapter "Application information").
VERSION SOT117-1 SOT136-1
1996 Dec 12
2
Philips Semiconductors
Product specification
Smart card interface
QUICK REFERENCE DATA SYMBOL VDD IDD Vth2 Vth4 VCC ICC PARAMETER supply voltage supply current threshold voltage on VSUP threshold voltage on VDD card supply voltage card supply current including static and dynamic loads on 100 nF capacitor operating detection limitation VH VPP high voltage supply for VPP card programming voltage (only at TDA8001 and TDA8001T) (P = 5, 12.5, 15 and 21 V) programming current (read or write mode) including static and dynamic loads on 100 nF capacitor idle mode; VDD = 12 V active modes; unloaded CONDITIONS - - 4.5 6 4.75 - - - - MIN. 6.7 - 32 45 - - 5.0 - -150 - - TYP. - -
TDA8001
MAX. 18
UNIT V mA mA V V V mA mA mA V
4.72 6.5 5.25 -100 - -200 30
P - 2.5% -
P + 2.5% V
IPP
operating detection limitation
- - -
- -75 - 0.38 100 - - - -
-50 - -100 - 125 8 0.92 2 +70
mA mA mA V/s s MHz W W C
SR tde fclk Ptot
slew rate on VCC and VPP (rise and fall) deactivation cycle duration clock frequency continuous total power dissipation
maximum load capacitor 150 nF - 75 0 TDA8001; Tamb = +70 C; see Fig.10 TDA8001T; Tamb = +70 C; see Fig.11 - - 0
Tamb
operating ambient temperature
1996 Dec 12
3
Philips Semiconductors
Product specification
Smart card interface
BLOCK DIAGRAM
TDA8001
handbook, full pagewidth
VSUP 15 ALARM ALARM 17 18
DELAY 16
VDD 13
GND1 12 22
VOLTAGE SUPERVISOR
MAIN SUPPLY
CVNC
I/O(C)
28 PROTECTIONS AND ENABLE
3
I/O
RSTIN
26
4
RST
TDA8001
19 OFF 2 DETECT INTERNAL CLOCK 20 27 CMD7 25 GND2 23 CMD3.5 CLKOUT2 VPP12.5 VPP15 VPP21 24 6 7 21 VPP GENERATOR CLOCK CIRCUITRY CLOCK ENABLE PROTECTIONS LOGIC
9 8
PRES PRES
CMDVCC
VCC GENERATOR
14 VCC
5 CLK
10 VPP
OSCILLATOR 1 XTAL 11
MBH813
VH
Fig.1 Block diagram.
1996 Dec 12
4
Philips Semiconductors
Product specification
Smart card interface
PINNING PIN SYMBOL XTAL DETECT I/O RST CLK VPP12.5 n.c. VPP15 n.c. PRES PRES VPP n.c. VH GND1 VDD VCC VSUP DELAY ALARM ALARM OFF CMDVCC VPP21 n.c. CVNC CMD3.5 or CDMTC CLKOUT2 GND2 RSTIN CMD7 or CDMS I/O(C) TDA8001 TDA8001T 1 2 3 4 5 6 - 7 - 8 9 10 - 11 12 13 14 15 16 17 18 19 20 21 - 22 23 24 25 26 27 28 TDA8001A TDA8001AT 1 2 3 4 5 - 6 - 7 8 9 - 10 11 12 13 14 15 16 17 18 19 20 - 21 22 23 24 25 26 27 28 crystal connection card extraction open collector output (active LOW) data line to/from the card card reset output clock output to the card DESCRIPTION
TDA8001
control input for applying the 12.5 V programming voltage (active LOW) not connected control input for applying the 15 V programming voltage (active LOW) not connected card presence contact input (active LOW) card presence contact input (active HIGH) card programming voltage output not connected HIGH voltage supply for VPP generation ground 1 positive supply voltage card supply output voltage voltage supervisor input external capacitor connection for delayed reset timing open-collector reset output for the microcontroller (active HIGH) open-collector reset output for the microcontroller (active LOW) open-collector interrupt output to the microcontroller (active LOW) control input for applying supply voltage to the card (active LOW) control input for applying the 21 V programming voltage (active LOW) not connected internally generated 5 V reference, present when VDD is on; to be decoupled externally (100 nF) control input for having the crystal frequency divided-by-4 at pin CLK clock output to the microcontroller, or any other R4590 (crystal frequency divided by two) ground 2 card reset input from the microcontroller (active HIGH) control input for having the crystal frequency divided by 2 at pin CLK data line to/from the microcontroller
1996 Dec 12
5
Philips Semiconductors
Product specification
Smart card interface
TDA8001
handbook, halfpage
handbook, halfpage
XTAL 1 DETECT 2 I/O 3 RST 4 CLK 5 VPP12.5 6 VPP15 7 PRES 8 PRES 9 VPP 10 VH 11 GND1 12 VDD 13 VCC 14
MBH811
28 I/O(C) 27 CMD7 or CDMS 26 RSTIN 25 GND2 24 CLKOUT2 23 CMD3.5 or CDMTC 22 CVNC TDA8001 TDA8001T 21 VPP21 20 CMDVCC 19 OFF 18 ALARM 17 ALARM 16 DELAY 15 VSUP
XTAL 1 DETECT 2 I/O 3 RST 4 CLK 5 n.c. 6 n.c. 7
28 I/O(C) 27 CMD7 or CDMS 26 RSTIN 25 GND2 24 CLKOUT2 23 CMD3.5 or CDMTC
22 CVNC TDA8001A TDA8001AT 21 n.c. PRES 8 PRES 9 n.c. 10 VH 11 GND1 12 VDD 13 VCC 14
MBH812
20 CMDVCC 19 OFF 18 ALARM 17 ALARM 16 DELAY 15 VSUP
Fig.2 Pin configuration.
Fig.3 Pin configuration.
1996 Dec 12
6
Philips Semiconductors
Product specification
Smart card interface
FUNCTIONAL DESCRIPTION Power supply The circuit operates within a supply voltage range of 6.7 to 18 V. VDD and GND are the supply pins. All card contacts remain inactive during power up or down. POWER UP The logic part is powered first and is in the reset condition until VDD reaches Vth1. The sequencer is blocked until VDD reaches Vth4 + Vhys4. POWER DOWN When VDD falls below Vth4, an automatic deactivation of the contacts is performed. Voltage supervisor This block surveys the 5 V supply of the microcontroller (VSUP) in order to deliver a defined reset pulse and to avoid any transients on card contacts during power up or down of VSUP. The voltage supervisor remains active even if VDD is powered-down. POWER ON As long as VSUP is below Vth2 + Vhys2 the capacitor CDEL, connected to pin DELAY, will be discharged. When VSUP rises to the threshold level, CDEL will be recharged. ALARM and ALARM remain active, and the sequencer is blocked until the voltage on the DELAY line reaches Vth3. POWER DOWN (see Fig.4) If VSUP falls below Vth2, CDEL will be discharged, ALARM and ALARM become active, and an automatic deactivation of the contacts is performed. Clock circuitry (see Fig.5) The clock signal (CLK) can be applied to the card in two different methods: 1. Generation by a crystal oscillator: the crystal, or the ceramic resonator (4 to 16 MHz) is connected to the XTAL pin. 2. Use of a signal frequency (up to 20 MHz), already present in the system and connected to the XTAL pin via a 10 nF capacitor (see Fig.14). In both cases the frequency is first divided-by-two. If CMD7 (respectively CMD3.5) is LOW, the clock signal (its frequency again divided by two) is enabled and buffered before being fed to the CLK pin. 1996 Dec 12 7
TDA8001
CMD3.5 and internal ENRST are sampled in order to give the first clock pulse the correct width, and to avoid false pulses during frequency change. The CLKOUT2 pins may be used to clock a microcontroller or an other TDA8001. The signal 12 fxtal is available when the circuit is powered up. State diagram Once activated, the circuit has six possible modes of operation: * Idle * Activation * Read * Write * Deactivation * Fault. Figure 6 shows the way these modes are accessible. IDLE MODE After reset, the circuit enters the IDLE state. A minimum number of circuits are active while waiting for the microcontroller to start a session. * All card contacts are inactive * I/O(C) is high impedance * Voltage generators are stopped * Oscillator or XTAL input is running, delivering CLKOUT2 * Voltage supervisors are active. The DETECT line is HIGH if a card is present (PRES and PRES active) and LOW if a card is not present. The OFF line is HIGH if no hardware problem is detected. ACTIVATION SEQUENCE From the IDLE mode, the circuit enters the ACTIVATION mode when the microcontroller sets the CMDVCC line (active LOW). The I/O(C) signal must not be LOW. The internal circuitry is activated, the internal clock starts and the sequence according to ISO7816 is performed: * VCC rises from 0 to 5 V * VPP rises from 0 to 5 V and I/O is enabled * CLK and RST are enabled. The time interval between steps 1 and 2 is 16 s, and 64 s between steps 2 and 3 (see Fig.7).
Philips Semiconductors
Product specification
Smart card interface
READ MODE When the activation sequence is completed and, after the card has replied its Answer-to-Reset, the TDA8001 will be in the READ mode. Data is exchanged between the card and the microcontroller via the I/O line. WRITE MODE Cards with EPROM memory need a programming voltage (VPP). When it is required to write to the internal memory of the card, the microcontroller sets one of the VPP12.5, VPP15 and VPP21 lines LOW, according to the programming value given in the Answer-to-Reset. VPP rises from 5 V to the selected value with a typical slew rate of 0.38 V/s. In order to respect the ISO 7816 slopes, the circuit generates VPP by charging and discharging an internal capacitor. The voltage on this capacitor is then amplified by a power stage gain of 5, powered via an external supply pin VH (30 V max). DEACTIVATION SEQUENCE (see Fig.8) When the session is completed, the microcontroller sets the CMDVCC line to its HIGH state. The circuit then executes an automatic deactivation sequence by counting the sequencer back: * RST falls to LOW and CLK is stopped * I/O(C) becomes high impedance and VPP falls to 0 V * VCC falls to 0 V.
TDA8001
The circuit returns to the IDLE mode on the next rising edge of the clock. PROTECTIONS Main fault conditions are monitored by the circuit: * Short-circuit or overcurrent on VCC * Short-circuit or overcurrent on VPP * Card extraction during transaction * Overheating problem * VSUP drop-out * VDD drop-out. When one of these fault conditions is detected, the circuit pulls the interrupt line OFF to its active LOW state and returns to the FAULT mode. The current on I/O is internally limited to 5 mA. FAULT MODE (see Fig.9) When a fault condition is written to the microcontroller via the OFF line, the circuit initiates a deactivation sequence. After the deactivation sequence has been completed, the OFF line is reset to its HIGH state after the microcontroller has reset the CMDVCC line HIGH.
handbook, full pagewidth
Vth2 + Vhys2 Vth2
VSUP
VDELAY
Vth3
td
ALARM
MGG818
Fig.4 Alarm and delay as a function of VSUP (CDEL fixes the pulse width).
1996 Dec 12
8
Philips Semiconductors
Product specification
Smart card interface
TDA8001
handbook, full pagewidth
ENCLK S S QH
CDMS
CDMTC
S S QB
QI QD
D
Q
QE
CK Q QG D Q QC QF QCA CK Q QAA D Q QA CLK
XTAL QBA
CK Q
CMD7 or CDMS = Z Z 1 1 0 0 CMD3.5 or CDMTC = 1 0 1 0 1 0 CLK = 2 4 0 4 2 4
1/2 CLKOUT
QB QC QD ENCLK QF CLK
MGG827
Fig.5 Clock circuitry.
1996 Dec 12
9
Philips Semiconductors
Product specification
Smart card interface
TDA8001
handbook, full pagewidth
ACTIVATION
PDOWN
IDLE
FAULT
WRITE
READ
DEACTIVATION
MGG820
Fig.6 State diagram.
handbook, full pagewidth
0
1
2
3
OFF PRES DETECT CMDVCC VEILLE (INTERNAL) INTERNAL CLOCK VCC I/O VPP CMD3.5 CLK ENRST (INTERNAL) RSTIN RST t2 tact
MGG828
Fig.7 Activation sequence.
1996 Dec 12
10
Philips Semiconductors
Product specification
Smart card interface
TDA8001
handbook, full pagewidth
3
2
1
0
CMDVCC VEILLE (INTERNAL) INTERNAL CLOCK VCC I/O VPP CMD3.5 CLK ENRST (INTERNAL) RSTIN RST
MGG829
tde
Fig.8 Deactivation sequence.
handbook, full pagewidth
3
2
1
0
PRES DETECT CMDVCC VEILLE (INTERNAL) INTERNAL CLOCK VCC I/O
VPP
CMD3.5 CLK ENRST (INTERNAL) RSTIN RST tde
MGG830
Fig.9 Deactivation after a card extraction during write mode.
1996 Dec 12
11
Philips Semiconductors
Product specification
Smart card interface
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD Vx1 VH VPP VSUP Vx2 Vx3 Vx4 Ptot supply voltage voltage on pins VPP21, VPP15, VPP12.5, PRES, PRES, CMDVCC, OFF, ALARM, DETECT and RSTIN voltage on pin VH voltage on pin VPP voltage on pin VSUP voltage on pins ALARM and DELAY voltage on pins XTAL, I/O(C), CLKOUT2, CMD7, CMD3.5 and CVNC voltage on pins I/O, RST, CLK and VCC continuous total power dissipation duration < 1 ms TDA8001; Tamb = +70 C; note 1; see Fig.10 TDA8001T; Tamb = +70 C; note 1; see Fig.11 Tstg Ves storage temperature electrostatic voltage on pins I/O, VCC, VPP, RST, CLK, PRES and PRES electrostatic voltage on other pins Note PARAMETER CONDITIONS MIN. -0.3 0 0 0 0 0 0 0 -
TDA8001
MAX. 18 VDD 30 VH 12 VSUP 6.0 7.0 2
UNIT V V V V V V V V W
-
0.92
W
-55 -6 -2
+150 +6 +2
C kV kV
1. Ptot = VDD x (IDD(unloaded) + Isignals) + ICC x (VDD - VCC) + max.{(VH - VPP) x IPP(read) + (VH - VPP) x IPP(write)} + VH x IH(unloaded) + VSUP x ISUP + (VDD - CVNC) x ICVNC, where `signals' means all signal pins, except supply pins.
1996 Dec 12
12
Philips Semiconductors
Product specification
Smart card interface
TDA8001
handbook, halfpage
4
MBE256
handbook, halfpage
3
MBE255
P tot (W) 3
P tot (W) 2
2
1
1
0 50 0 50 100 150 Tamb ( o C)
0 50 0 50 100 150 Tamb ( o C)
Fig.10 Power derating curve (DIP28).
Fig.11 Power derating curve (SO28).
HANDLING Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining. Method 3015 (HBM 1500 , 100 pF) 3 pulses positive and 3 pulse negative on each pin referenced to ground. THERMAL CHARACTERISTICS SYMBOL Rth j-a SOT117-1 SOT136-1 PARAMETER thermal resistance from junction to ambient in free air 30 70 K/W K/W VALUE UNIT
1996 Dec 12
13
Philips Semiconductors
Product specification
Smart card interface
CHARACTERISTICS VDD = 12 V; VH = 25 V; VSUP = 5 V; Tamb = 25 C; unless otherwise specified. SYMBOL Supply VDD IDD supply voltage supply current idle mode; VDD = 8 V idle mode; VDD = 18 V active mode; unloaded Vth1 Vth4 Vhys4 VSUP ISUP Vth2 Vhys2 Vth3 IDEL VDEL IOH VOL IOL VOH td tpulse IOH VOL VIL VIH IIL threshold voltage for power-on reset threshold voltage on VDD (falling) hysteresis on Vth4 voltage supply for the supervisor input current at VSUP threshold voltage on VSUP (falling) hysteresis on Vth2 threshold voltage on DELAY output current at DELAY voltage on pin DELAY VOH = 5 V IOL = 2 mA VOL = 0 V IOH = -2 mA CDEL = 47 nF; see Fig.4 CDEL = 47 nF VOH = 5 V IOL = 1 mA pin grounded (charge) VDEL = 4 V (discharge) ALARM, ALARM (open-collector outputs) HIGH level output current on pin ALARM LOW level output voltage on pin ALARM LOW level output current on pin ALARM HIGH level output voltage on pin ALARM delay between VSUP and ALARM ALARM pulse width - - - VSUP - 1 - 15 - - - 1.5 VIL = 0 V - - - - - - - - - - - - 6.7 20 22 35 - 6.0 50 - - 4.5 10 2.35 -5 6 - - 30 34 45 3.0 - - PARAMETER CONDITIONS MIN. TYP.
TDA8001
MAX.
UNIT
18 38 42 55 4.0 6.5 200 - 2.4 4.72 80 2.65 -2 - 3.5
V mA mA mA V V mV
Voltage supervisor 5.0 1.8 - - - - - - V mA V mV V A mA V A V A V s ms A V
25 0.4 -25 - 10 50
Interrupt lines OFF and DETECT (open-collector) HIGH level output current LOW level output voltage 25 0.4
Logic inputs (CMDVCC, VPP21, VPP15, VPP12.5, CMD7, CMD3.5, PRES, PRES and RSTIN); note 1 LOW level input voltage HIGH level input voltage LOW level input current 0.8 - -10 V V A
1996 Dec 12
14
Philips Semiconductors
Product specification
Smart card interface
TDA8001
SYMBOL IIH VIDLE VOL VOH tRST VIDLE VOL VOH
PARAMETER HIGH level input current
CONDITIONS VIH = 5 V - - IOL = 200 A IOH = -200 A IOH = -10 A RST enabled; see Fig.7 - 4.3
MIN. - - - - - - - - - - - - - - - -
TYP. 10
MAX.
UNIT A
Reset output to the card (RST) output voltage in IDLE LOW level output voltage HIGH level output voltage delay between RSTIN and RST 0.4 0.45 VCC VCC 2 V V V V s
VCC - 0.7 - -
Clock output to the card (CLK) output voltage in IDLE LOW level output voltage HIGH level output voltage IOL = 200 A IOH = -200 A IOH = -20 A IOH = -10 A tr tf rise time fall time duty factor CL = 30 pF; note 2 CL = 30 pF; note 2 CL = 30 pF; note 2 0.4 0.4 VCC VCC VCC 14 14 55 V V V V V ns ns % - 2.4 0.7VCC VCC - 0.7 - - 45 - VCC - 4%
Card programming voltage (VPP) VPP output voltage idle mode read mode write mode; IPP < 50 mA IPP/t < 40 mA/100 ns; note 4 IPP SR output current slew rate active; from 0 to P (3) VPP shorted to GND up or down High voltage input (VH) VH IH input voltage input current at VH idle mode; active mode; unloaded P=5V P = 12.5 V P = 15 V P = 21 V VH-VPP voltage drop - 4 5 6.5 7 8 - - - - - - - - 30 6 9 10.5 11 12 2.2 V mA mA mA mA mA V 0.4 VCC + 4% V V
P - 2.5%(3) - P - 2.5%(3) - - - 0.3 - - 0.4
P + 2.5%(3) V P + 2.5%(3) V -50 -100 0.5 mA mA V/s
1996 Dec 12
15
Philips Semiconductors
Product specification
Smart card interface
TDA8001
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Card supply voltage (VCC) VCC output voltage idle mode; active mode ICC < 100 mA IPP/t < 100 mA/100 ns; note 4 ICC SR output current slew rate VCC from 0 to 5 V VCC shorted to GND up or down 5 V reference output voltage (CVNC) VCVNC ICVNC Rxtal(neg) Vxtal fxtal output voltage at pin CVNC output current at pin CVNC 4.5 - - 3.0 4 0 5.0 - - - - - - - - - - - - 5.5 -50 V mA V MHz MHz - 4.75 4.75 - - 0.3 - - - - - 0.4 0.4 5.25 5.25 -100 -200 0.5 V V V mA mA V/s
Crystal connection (XTAL) negative resistance at pin XTAL DC voltage at pin XTAL resonant frequency external frequency Clock output (CLKOUT2) fCLKOUT2 VOL VOH tr, tf frequency on CLKOUT2 LOW level output voltage HIGH level output voltage rise and fall times duty factor IOL = 2 mA IOH = -200 A IOH = -10 A CL = 15 pF; note 2 CL = 15 pF; note 2 4.5 V < VSUP < 5.5 V; 4.5 V < VI/O(C) < 5.5 V; IOH = -20 A 4.5 V < VSUP < 5.5 V; 4.5 V < V I/O(C) < 5.5 V; IOH = -200 A VOL IIL VOH VOL IIL LOW level output voltage on pin I/O LOW level input current on pin I/O(C) HIGH level output voltage on pin I/O(C) LOW level output voltage on pin I/O(C) II/O = 1 mA; I/O(C) grounded I/O(C) grounded 4.5 V < VI/O < 5.5 V II/O(C) = 1 mA; I/O grounded 1 - 3.0 4.0 - 40 8 0.4 - - 25 60 MHz V V V ns % 2 MHz < fi < 16 MHz; note 5 300 4.0 16 20
Data line [I/O, I/O(C)] VOH HIGH level output voltage on pin I/O 4.0 VCC + 0.1 V
2.4
-
-
V
- - 4.0 - -
- - - - -
100 -500 VSUP + 0.2 70 -500
mV A V mV A
LOW level input current on pin I/O I/O grounded
1996 Dec 12
16
Philips Semiconductors
Product specification
Smart card interface
TDA8001
SYMBOL VIDLE ZIDLE Rpu tr, tf Protections Tsd ICC(sd) IPP(sd) II/O(lim) Timing tact tde t3 t5 tst Notes
PARAMETER voltage on pin I/O outside a session impedance on pin I/O(C) outside a session internal pull-up resistance between pin I/O and VCC rise and fall times
CONDITIONS - 10 8 Ci = Co = 30 pF - - - - from I/O to I/O(C) 3 - - - 80 -
MIN. - -
TYP.
MAX. 0.4 - 12 0.5 - - - 5 - - 70 - 30
UNIT V M k s C mA mA mA s s s s s
10 -
shut-down local temperature shut-down current at VCC shut-down current at VPP current limitation on pin I/O
135 -150 -75 -
activation sequence duration deactivation sequence duration start of the window for sending CLK to the card end of the window for sending CLK to the card maximum pulse width on CMDVCC before VCC starts rising
see Fig.7 see Fig.8
110 100 - - -
1. Pins CMDVCC, VPP21, VPP15, VPP12.5, CMD7, CMD3.5 and PRES are active LOW; pins RSTIN and PRES are active HIGH. t1 2. The transition time and duty cycle definitions are shown in Fig.12; = -------------- . t1 + t2 3. P is the card programming voltage set by pin VPP12.5, VPP15 or VPP21. 4. The tests for dynamic response of both VPP and VCC are performed at 1 Hz, 10 kHz, 100 kHz and 1 MHz, with a capacitive load of 100 nF. 5. This condition ensures proper starting of the oscillator with crystals having a series resistance up to 100 .
handbook, full pagewidth
tr 90%
tf 90% VOH 1.5 V
10% t1
10% t2
MBH856
VOL
Fig.12 Definition of transition times.
1996 Dec 12
17
Philips Semiconductors
Product specification
Smart card interface
INTERNAL PIN CONFIGURATION
TDA8001
handbook, full pagewidth
VSUP XTAL 100 A DETECT VCC VCC 100 A 5V I/O VCC 5 k 100 VCC 100 A as VPP12.5 as VPP12.5 CMD7 RSTIN GND2 CLKOUT2 100 A 100 A I/O(C)
RST
VCC 10 k 50
VCC
TDA8001
VDD as VPP12.5 CMD3.5 CVNC 1350 650 as VPP12.5 as VPP12.5 VPP21 CMDVCC OFF
CLK
20 A 1.25 V
VPP12.5
ALARM VSUP
VSUP VPP15 PRES PRES as VPP12.5 as VPP12.5 as VPP12.5 VH 2.5 V 100 A ALARM 2.5 V 2.5 A DELAY
VPP
VH GND1 VDD 1.25 V VCC as VPP12.5
20 A
100 A
20 A VSUP 4690 5310
MBE257
Fig.13 Internal pin configuration.
1996 Dec 12
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Philips Semiconductors
Product specification
Smart card interface
APPLICATION INFORMATION
TDA8001
+5 handbook, full pagewidth V to 8805 microcontroller
(1)
100 nF 12 V 25 V (2)
VDD
RST
ALARM ALARM VSUP CVNC VDD OFF
VH PRES
INT0
DETECT PRES I/O(C) CMDVCC VPP15 RST C2 VCC 100 nF C1
PORT 1
VPP12.5 VPP21 RSTIN TDA8001 C4 CLK C3
12 V 10 F PORT 2 25 V 10 F XTAL1 XTAL2 80C52 MICROCONTROLLER GND CLKOUT2 I/O GND2 VPP CMD7 CMD3.5
C5
C6 100 nF C7
GND
C8 DELAY GND1 XTAL 1 k 14 MHz 47 nF CARD SOCKET
MGG831
47 nF
(1) The capacitor should be placed as close as possible to the IC. (2) If pin VH is not connected to 25 V, it should be connected to VDD.
Fig.14 Application in a pay TV decoder.
1996 Dec 12
19
Philips Semiconductors
Product specification
Smart card interface
PACKAGE OUTLINES
handbook, plastic dual in-line package; 28 leads (600 mil) DIP28: full pagewidth
TDA8001
SOT117-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 28 15 MH wM (e 1)
pin 1 index E
1
14
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.020 0.014 c 0.32 0.23 0.013 0.009 D (1) 36.0 35.0 1.41 1.34 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 1.7 0.067
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT117-1 REFERENCES IEC 051G05 JEDEC MO-015AH EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-14
1996 Dec 12
20
Philips Semiconductors
Product specification
Smart card interface
TDA8001
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 91-08-13 95-01-24
1996 Dec 12
21
Philips Semiconductors
Product specification
Smart card interface
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
TDA8001
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Dec 12
22
Philips Semiconductors
Product specification
Smart card interface
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8001
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Dec 12
23
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/1200/02/pp24
Date of release: 1996 Dec 12
Document order number:
9397 750 01384

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